der8auer Skylake-X Direct Die Frame

Product information: Skylake-X Direct Die Frame The Skylake-X Direct Die Frame from overclocking champion der8auer is a masterpiece of German engineering. The CPU mounting frame completely replaces Intels ILM (Integrated Loading Mechanism) as well as the CPU cooler mounting holes. This inconspicuous component unlocks a world of possibilities when it comes to CPU performance enhancement, leading to record breaking overclocks when paired with either standard or liquid cooling. The der8auer Skylake-X Direct Die Frame: Allows the CPU to be operated and cooled without a heatspreader Secure mounting for maximum cooling performance Compatible with current Socket 2066 motherboards Manufactured in high-grade black anodized aluminium Taking Overclocking to the Limit The nickel-plated copper heat spreader, in the factory default setup, removes the heat produced by the CPU and transfers it into the CPU cooler which dissipates the thermal energy across a larger surface area than that available to the silicon alone. However the role of forming a tight seal between said components falls to a Thermal Interface Material (TIM) located between the heat spreader and the silicon chip. This standard thermal paste supplied with Intel processors offers relatively low levels of thermal conductivity, as a result of this it frequently struggles to maintain reasonable temperatures when faced with heavy overclocking. In this scenario the effectiveness of the CPU cooler is irrelevant due to the fact that heat build-up is taking place within the interior of the processor package itself. For a CPU to receive adequate cooling, even when being pushed to its limits via overclocking, enthusiasts swiftly remove the heat spreader with the help of the der8auer Delid Die Mate X, replacing the thermal paste with liquid metal and subsequently remounting the heat spreader. This results in a typical 10-20°C reduction in the temperatures of Intel Skylake-X processors. The Skylake-X Direct Die Frame remove...